There are several key applications where metal additive manufacturing provides solutions for semiconductor capital equipment and other high-tech equipment, eliminating constraints from traditional design and manufacturing production methods. Semiconductor lithography, wafer processing, and test equipment rely on structural parts that move fast while maintaining positional accuracy and, as a result, require flexures which can be difficult to make using traditional manufacturing methods. Additive manufacturing allows for the structural optimization and light-weighting of advanced flexure designs that reduce weight and minimize vibration to meet the exacting requirements of semiconductor capital equipment. Check out several benefits of using additive manufacturing for flexures and structural components and download our Semiconductor Flexures Application Brief to learn more.
Additive Manufactuing for Semiconductor Capital Equipment - Structurally Optimizing Flexures